About Company

不断研发创新
创造更美好的Display未来。

이미지
이미지

Mini & Micro LED

Repairing chip defects in the manufacturing process of mini or micro LED displays

构成 / 适用领域

▶ Defective Chip Detection: AOI function

▶ Defective Chip Removal: Laser Trimming

▶ Electrode formation: ink paste and curing

▶ Transfer and bonding: Transferring good LED chip and bonding

▶ Repairing defective chips in Mini & Micro LED display manufacturing process

特点 / 功能

▶ Laser trimming of defective Mini & Micro LED chips without any damage of under layer

▶ Paste soldering technology for forming Mini LED electrode

▶ Ag ink soldering technology for micro LED electrode formation

▶ Pick and place technology for mini LED chip transfer

▶ Chip bonding using laser heat source

▶ AOI, Auto Repair, lighting inspection can be added