Details & Application
▶ 检测出不良 Chip : AOI 功能
▶ 去除不良 Chip : 激光 Trimming
▶ 形成电极 : 涂上Ink后硬化
▶ Chip 取放和 bonding: 良品 LED Chip 取放后 bonding
▶ Mini & Micro LED Display 制造工艺
Features & Specification
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Mini & Micro LED
Details & Application
Features & Specification